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The course of acute viral nervous system infections may show a variety of symptoms and severity. In childhood, a number of viral and bacterial agents can induce neurological manifestations. A retrospective study of childhood cases of acute viral nervous system infections was performed. All the information was collected by a pre-tested questionnaire. A total of 1573 children (age range 1 to 13 years old) were included in the study. One-hundred forty-nine (9.5%) children experienced 269 episodes of viral nervous system infections. Fifty-nine percent of them were related to respiratory infections and 35% to gastrointestinal infections. The most common symptoms associated with respiratory infections were fever (59%), cough (52%), and coryza (46%). On the other hand, the most common symptoms associated with gastrointestinal infections were fever (40%), diarrhea (34%), and vomiting (30%). An increase of specific humoral and cellular immune responses may be responsible for the favorable prognosis observed in more than 80% of children.Islamic State released a new video this week showing the first in a series of what appear to be beheading attempts in Algeria. The video shows a man in an orange jumpsuit kneeling
HD Online Player (Gravity.3D.2013.1080p.BluRay.Half-SB) > DOWNLOAD.1. Field of the Invention
The present invention relates to a method of dispersing a plurality of liquid carriers, and more particularly to a method of dispersing a plurality of liquid carriers to distribute at a required rate and to thereby form a plurality of microsized liquid carriers.
2. Description of the Prior Art
For the purpose of making the object to be doped with a semiconductor liquid, the object to be doped is formed, using a mass-production type of equipment, into a semiconductor wafer-shaped substrate having a size of, for example, 300 mm in diameter, and the semiconductor wafer substrate having a doped object to be formed thereon is cut into a plurality of semiconductor chips each having a size of, for example, 50 mm.times.20 mm.
In such a method of manufacturing semiconductor chips, a liquid dispersion, for example, of a solution of the semiconductor dopant, such as a solution of phosphorus or arsenic, is fed onto the semiconductor wafer substrate which has not yet been cut into chips. The composition, on the substrate, of the liquid dispersion varies due to the region and the amount of dopant to be supplied onto the semiconductor wafer substrate.
With the foregoing in mind, the present applicant has proposed a method of doping a semiconductor wafer substrate, using a liquid dispersion formed from a plurality of liquid carriers mixed with a plurality of semiconductor dopants, as disclosed in the specification of European Patent Application No. 88-101,885 filed on Apr. 22, 1988. The proposed method and the invention thereof are explained in greater detail hereunder.
In the conventional method of doping a semiconductor wafer substrate, a liquid dispersion comprising a plurality of liquid carriers, such as solutions, each having a different concentration of a semiconductor dopant, is fed onto a semiconductor wafer substrate in the form of a spray to thereby form on the substrate a plurality of microsized liquid dispersion regions having the different dopant concentration respectively. In the liquid dispersion regions, a state of uniformity and stability can be maintained during the period from formation of the liquid dispersion until application thereof to the semiconductor wafer substrate. At the same time, the shape of each of the liquid dispersion regions can be controlled.
However, in a case where the liquid dispersion
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